SUHAIDI Latip. (2006). Process Capability Analysis for Wire Bonding. Universiti Putra Malaysia.
Chicago Style (17th ed.) CitationSUHAIDI Latip. Process Capability Analysis for Wire Bonding. Serdang: Universiti Putra Malaysia, 2006.
MLA (9th ed.) CitationSUHAIDI Latip. Process Capability Analysis for Wire Bonding. Universiti Putra Malaysia, 2006.
Warning: These citations may not always be 100% accurate.